TKEVI Cut Off Mark 2020 – Departmental Cut off Points… The Timeon Kairos Polytechnic, TKEVI UTME Cut Off Mark required for Admission into various Undergraduate Programmes has been released online the 2020/2021 academic session.
SeviPortal has published the TKEVI Cut Off Mark and Departmental Cut Off Marks as released by the management for the 2020/2021 UTME admission exercise. If you score exactly or above the minimum TKEVI Cut Off Mark, you are eligible and qualify for TKEVI Post UTME.
TKEVI Cut Off Mark 2020 (General)
The following is the officially approved minimum cut off mark for admission into TKEVI for 2020/2021 academic year:
|TKEVI Cut-Off Mark||180|
|TKEVI Post UTME Form||Apply Here|
If you scored 180 and above in JAMB UTME Result, then you are qualified and eligible to apply for the TKEVI Post UTME Screening. If unfortunately, your UTME Score falls below 180, you will need to consider another school that meets your score.
TKEVI Departmental Cut Off Mark 2020
Timeon Kairos Polytechnic, TKEVI Departmental Cut Off Marks 2020/2021 has not been officially released. The following are just assumed points. Please always confirm from an official source.
TKEVI Faculty of Medical Sciences Cut Off Mark
Medicine – 250 and Above
TKEVI Faculty of Law Cut Off Mark
Law – 240 and above
TKEVI Faculty of Engineering Cut Off Mark
Mechanical, Chemical, Electrical, Civil, Computer, etc – 220 and above
TKEVI Faculty of Science Cut Off Mark
Industrial Chemistry, Industrial Physics, Computer Science, Geology, Microbiology, Biochemistry, Anatomy, etc – 190 and above
Due to the high number of students wishing to study at Timeon Kairos Polytechnic (TKEVI), the admission processes are competitive and admissions are given based on the higher the jamb scores, the higher the chances of being admitted.
Note: Meeting the minimum TKEVI cut off mark does not guarantee admission into your desired degree programme, your Post UTME Score, O’Level Grades, Subject Combination, JAMB Score and other factors are pre-requisite for admission to TKEVI.
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